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项目
Item
技术规格
Technical Specification
测 试 方 法
Test Method and Remarks
将电容在 80~120℃的温度下预热 10~30 秒.
Preheating conditions:80 to 120℃; 10~30s.
可焊性
Solderability
上锡率应大于 95%
外观:无可见损伤.
At least 95% of the terminal electrode is
covered by new solder.
Visual Appearance: No visible damage.
有铅焊料:(Sn/Pb:63/37)
浸锡温度: 235±5℃
浸锡时间: 2±0.5s
Solder Temperature: 235±5℃
Duration: 2±0.5s
无铅焊料:
浸锡温度: 245±5℃
浸锡时间: 2±0.5s
Solder Temperature: 245±5℃
Duration: 2±0.5s
Δ
C/C
在±0.5%或±0.5pF范围内,取较大值
Within ±0.5% or ±0.5pF,whichever is
larger
Q 同初始标准
Same to initial value.
IR 同初始标准
Same to initial value.
耐焊接热
Resistance to
Soldering Heat
外观:无可见损伤 上锡率:≥95%
Appearance:No visible damage.At least
95% of the terminal electrode is covered by
new solder.
将电容在 100~200℃的温度下预热 10±2 分钟.
浸锡温度: 265±5℃
浸锡时间: 10±1s
然后取出溶剂清洗干净,国产电阻电容,在 10 倍以上的显微镜底下
观察.
放置时间:24±2 小时 放置条件:室温
Preheating conditions: 100 to 200℃; 10±2min.
Solder Temperature: 265±5℃
Duration: 10±1s
Clean the capacitor with solvent and examine it with a
10X(min.) microscope.
Recovery Time: 24±2h
Recovery condition: Room temperature
手工焊接很容易因为芯片局部受热不均而引起瓷体微裂或局部BAO炸的现象,电阻电容价格,在焊接时,电阻电容,如果操作者不小
心,电阻电容代理,会使烙铁头直接同电容芯片的瓷体部分接触,这样很容易使电容芯片因热冲击而受损或出现其他意外.因
此,使用电烙铁手工焊接时应仔细操作,并对电烙铁的尖端的选择和尖端温度控制应多加小心.
Manual soldering can pose a great risk of creating thermal cracks in capacitors. The hot soldering iron tip
comes into direct contact with the end terminations, and operator’s careless may cause the tip of the soldering iron
to come into direct contact with the ceramic body of the capacitor. Therefore the soldering iron must be handled
carefully, and pay much attention to the selection of the soldering iron tip and temperature contact of the tip.
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